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| Advance Product Information December 1, 2004 10Gb/s Linear AGC Receive Module * * * * * * * * TGA2950-SL Key Features and Performance 40kHz - 7GHz Bandwidth 36dB Small Signal Gain >50 dB Gain Adjustment Single-Ended Input, Differential Linear Output up to 2Vpp Peak Power Detector Surface Mount Package Low Power Dissipation Vdd = +5V, Vss = -5.2V Idd = 183mA, Iss = -3mA Package Dimensions: 0.450 x 0.350 x 0.090 inches Vdd=+5V; Vss=-5.2V; Vg1=-0.9V; Vg2=-0.7V; AGC=0V; XOVR=1.9V 40 35 30 25 Gain (dB) 20 15 10 5 0 -5 -10 0 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20 Primary Applications * * Linear Receive AGC * Preliminary Measured Performance 20 15 10 5 0 -5 -10 -15 -20 -25 -30 Return Loss (dB) Description The TriQuint TGA2950-SL is a surface mount, broad band AGC amplifier suitable for linear Fiber-Optic receive applications. The TGA2950 consists of multiple high performance wideband amplifier MMICs and off-chip components assembled in laminate surface mount package. The amplifier converts a single-ended input signal to differential outputs and provides up to 36dB of single-ended linear gain with 50dB of gain adjustment. Through proper use of the AGC function, the device can maintain a linear single-ended output signal up to 1VPP for input signals as large as 1VPP. The TGA2950 dissipates less than 1W of DC power from MSA compatible +5.0V and -5.2V supplies. The amplifier also features an output power detect function and internal DC blocks on all RF ports. The TGA2950-SL is available on an evaluation board. S21 S11 S22 Typical Input (450mVpp) AGC set for 800mVpp diff output 100mV/div 20psec/div Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 TGA2950-SL TABLE I MAXIMUM RATINGS Symbol Vdd Vss Idd | Iss | Vg AGC XOVR VIN PD TCH TM TSTG 1/ 2/ 3/ 4/ Parameter Positive Supply Voltage Negative Supply Voltage Positive Supply Current (Quiescent) Negative Supply Current Gate Voltage Range AGC Voltage Range Crossover Voltage Range Input Continuous Wave Voltage Power Dissipation Operating Channel Temperature Mounting Temperature (10 seconds) Storage Temperature Value 8V -6 V TBD TBD TBD TBD TBD 2 Vpp TBD 150 C 260 C -65 to 150 0C 0 0 Notes 1/ 2/ 1/ 1/ 2/ 1/ 1/ 1/ 1/ 1/ 2/ 1/ 2/ 3/ 4/ These ratings represent the maximum operable values for this device Combinations of supply voltage, supply current, input power, and output power shall not exceed PD at a package base temperature of 70C When operated at this bias condition with a baseplate temperature of 70C, the MTTF is reduced to 1.0E+6 hours Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TABLE II THERMAL INFORMATION Parameter RJC Thermal Resistance (Channel to Backside of Package) Test Conditions Vdd = 5V Idd = 250mA PDISS = 1.27W TBASE = 70C TCH (C) 76.9 RJC (C/W) 5.4 MTTF (hrs) 1.8E9 Note: Thermal transfer is conducted through the bottom of the TGA2950-EPU-SL package into the motherboard. The motherboard must be designed to assure adequate thermal transfer to the base plate. 2 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 TABLE III RF CHARACTERIZATION TABLE (TA = 25C, Nominal) (Vdd = 5V, Idd = 183mA 5%) Symbol Parameter Test Conditions Typ TGA2950-SL Units Notes Gain Maximum Small Signal Gain F = 1 GHz 36 dB Gain Minimum Small Signal Gain F = 1 GHz -12 dB BW Small Signal 3dB Bandwidth F = 40 kHz - 6 GHz F = 6 - 10 GHz F = 40 kHz - 6 GHz F = 6 - 10 GHz 7 13 10 15 8 GHz 1/ IRL Input Return Loss dB 1/ ORL Output Return Loss dB 1/ Note: Table III Lists the RF Characteristics of typical devices as determined by fixtured measurements. 1/ Parameters measured at maximum gain bias 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 Measured Performance Vdd=+5V; Vss=-5.2V; Vg1=-0.9V; Vg2=-0.7V; XOVR=1.9V TGA2950-SL 40 30 20 Gain (dB) 10 0 -10 -20 -30 -40 0 40 30 20 Gain (dB) 10 0 -10 -20 -30 1.E-05 AGC=0V AGC=-3.83V 2 4 6 8 10 12 Frequency (GHz) 14 16 18 20 AGC=0V AGC=-3.83V AGC=-4.11V 1.E-04 1.E-03 1.E-02 1.E-01 Frequency (GHz) 1.E+00 1.E+01 4 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 Measured Performance Vdd=+5V; Vss=-5.2V; Vg1=-0.9V; Vg2=-0.7V; XOVR=1.9V TGA2950-SL 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 0 40 35 30 Gain (dB) 25 20 15 10 5 0 0 2 4 6 8 10 12 Frequency (GHz) 14 16 18 20 S11 S22 2 4 6 8 10 12 Frequency (GHz) 14 16 18 20 75degC 55degC 25degC 0degC -25degC 5 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 Measured Performance Peak Detector 0.6 0.5 0.4 Vdet-Vref 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 Vout(Vpp) 0.6 0.7 15dB Gain 0dB Gain TGA2950-SL 0.8 0.9 6 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 Measured Performance TGA2950-SL Vin=25mVpp; Vout=300mVpp Vin=250mVpp; Vout=300mVpp Vin=500mVpp; Vout=300mVpp Vin=800mVpp; Vout=300mVpp Vin=1000mVpp; Vout=300mVpp 7 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 TGA2950-SL Bias Procedure Bias Up * Start with all voltages at 0V * Set AGC to 0V * Adjust Vg1 to -4V & Vg2 to -3V * Adjust Vdd to +5V (Idd should be ~78mA) * Adjust Vss to -5.2V (Iss should be ~ -3mA) * Adjust Vg1 for Idd=130mA (~ -2.8V) * Adjust Vg2 for Idd=183mA (~ -1.2V) * XOVR should be ~+1.9V * Adjust AGC for desired gain level (Idd will decrease as AGC is adjusted more negative) * Adjust XOVR, if needed, for desired eye crossing Bias Down * Disconnect XOVR * Set AGC to 0V * Set Vss to 0V * Set Vdd to 0V * Set Vg1 & Vg2 to 0V 8 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 TGA2950-SL Demonstration Board Schematic Vg1 C1 C2 Vg2 AGC C3 C4 15 14 13 12 11 10 9 RF Out + C5 DET REF DET 1 RF In TGA2950-SL RF Out 8 2 3 C7 C6 Vss Vdd C8 XOVR OADJ 4 5 6 7 C9 Designation Value C1, C2, C3, 4.7uF C6, C7 C4, C5, C8, 1.0uF C9 Vendor AVX AVX Part Number TACR475K010R 0805ZC105KA12A 9 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 Mechanical Drawing (View Through Top of Package) TGA2950-SL 10 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information December 1, 2004 TGA2950-SL Assembly of a TGA2950-SL Package onto a Motherboard Manual Assembly for Prototypes 1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry. 2. Using a standard SN63 solder paste, such as Kester SN63 R-560, dispense solder paste dots of 5 to 15 mil in diameter to the motherboard. Assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each solder paste area and the closest edge of the ground pad. 3. Manually place a TGA2950-SL on the motherboard with correct orientation and good alignment. The alignment can be determined manually by centering the package on the motherboard. The RF traces (pin 1 and pin 10) are located along the center horizontal axis of the package. 4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230 oC for 5 to 6 seconds. 5. Let the assembly completely cool down. This package has little or no tendency to self- align during the reflow. 6. Clean the assembly with acetone and rinse with alcohol and DI water. High Volume Assembly of the Package The TGA2950-SL is a standard surface mount component compatible with standard high volume assembly processes using standard SN63 solder paste, such as Kester R560. Refer to Kester R560 manufacture data sheet for recommended reflow profile, cleaning, and handling. Dispense solder paste using standard solder printing techniques such as stencil solder printing. Pick-and-place using a standard machine such as MRSI machine. Perform solder reflow using a Sikama Reflow System. Recommended solder stencil and motherboard interface layout are available upon request. 11 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com |
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